La banca dati MPMD contiene dati ed informazioni sulle proprietà termiche, meccaniche, elettriche e fisiche dei materiali per il packaging dei componenti microelettronici ed è disponibile in formato fruibile via Web. La banca dati è costantemente aggiornata ed ampliata.
Nella banca dati sono presenti 1.080 materiali e 23.450 curve dati con 405 proprietà.
Link
- MPMD Table of Contents
- MPMD Demo
Brochure MPMD- Video istruttivo – Instructions & demonstration of the MPMD/TPMD
Principali gruppi di materiali trattati
-
- Elements
Metal Alloys
- Solders – Leaded
- Solders – Lead Free
- Intermetallics, Miscellaneous
- Intermetallics, Aluminides
- Intermetallics, Beryllides
- Intermetallics, Silicides
- Ceramics – Oxides
- Ceramics – High K Oxides
- Ceramics – Nitrides, Silicides, Carbides,…
- Molding Compounds
- Encapsulants and Underfill Materials
- Adhesives
- Coating and Unfilled Epoxies
- Polymers – Polyimides
- Polymers – Others
- Composites – Thermal Management
- Composites – Laminates
- Semiconductors
- Liquids & Gases
- Elements
Principali proprietà presenti nel MPMD
Thermophysical Properties:
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- Coefficient of Thermal Expansion
- Coefficient of Thermal Expansion (Z)
- Contact Angle
- Cross-Linking Density
- Cure Degree
- Cure Temperature
- Curie Temperature
- Density
- Glass transition Temp (Master Curve)
- Glass Transition Temperature
- Interfacial Tension
- Liquide Temperature
- Mean Coeff. of Thermal Expansion
- Mean Coeff. of Thermal Expansion (Z)
- Molar Heat capacity
- Reflectance
- Relative Density
- Softening Temperature
- Solidus Temperature
- Specific Heat Capacity
- Surface Tension
- Thermal Conductivity
- Thermal Conductivity Film
- Thermal expansion
- Thermal Expansion (Z)
- Thermal Expansion Percent
- Thermal Impedance
- Thermal Resistance
- Thermal Resistance Junction – Heat Sink
- Viscosity
Electrical Properties:
-
- Attenuation
- Coefficient of Electrical Resistivity
- Dielectric Constant
- Dielectric Loss Index
- Dissipation Factor
- Electrical Conductivity
- Electrical Resistivity
- Electrical Resistivity, Film
- Electrical Resistivity, ohm m
- Insulation Resistance
- Leekage Conductance
- Permittivity
- Piezoelectric Constant
- Piezoresistance Coefficient
- Relative Electrical Resistance
- Seebeck Coefficient
- Surface Resistivity
- Volume Resistivity
Mechanical Properties – Modulus:
-
- Bulk ModulusGPa
- Bulk Modulus, MPa
- Compressive Modulus, GPa
- Compressive Modulus, MPA
- Dynamic Shear Modulus
- Dynamic Young’s Modulus
- Elastic Modulus (out-of-Plane)
- Flexural Modulus
- Flexural Modulus, MPa
- Loss Modulus
- Relaxation Modulus
- Relaxation Modulus (master Curve)
- Young’s Modulus, GPa
- Young’s Modulus, MPa
Mechanical Properties – Strength:
-
- Bend Strength
- Biaxial Flexural Strength, Ultimate
- Compressive Strength, Yield
- Die Shear Strength
- Flexural Strength
- Fracture Strength
- Lap Shear Strength
- Shear Strength
- Shear Strength, Yield
- Tensile Strength, Ultimate
- Tensile Strength, Break
-
- Tensile Strength, Yield
- Yield Strength, Flexural
-
Mechanical Properties – Stress:
-
- Biaxial Stress
- Biaxial Stress, Yield
- Compressive Lower Yield Stress
- Compressive Stress
- Compressive Stress, True
- Critical Resolved Shear Stress
- Cure Stress
- Elastic Flexural Limit
- Film Stress
- Flexural Stress
- Flow Stress
- Residual Stress
- Shear Stress
- Stress Relaxation
- Tensile Stress
- Tensile Stress, True
- Tensile Upper Yield Stress
- Thermal Stress
- Transverse Rupture Stress
Mechanical Properties – Hardness:
-
- Brinell hardness
- Knoop Hardness
- Microhardness
- Rockwell A Hardness
- Rockwell hardness
- Shore hardness
- Vickers Hardness
- Vickers Hardness, HV
- Mechanical Properties – Fatigue:
- Fatigue Life
- Fatigue Stress
- Fatigue, Bend Strain Range
- Fatigue, Load Drop
- Fatigue, Maximum Stress
- Fatique Shear Stress Range
- Fatigue Shear Strain Range
- Fatigue, Stress Amplitude
- Fatigue, Stress Amplitude Change
- Plastic Strain Range
Mechanical Properties – Creep:
-
- Compressive Creep Strain, True
- Creep Compliance
- Creep Life
- Creep Plastic Strain
- Creep Rate, Compressive
- Creep Rate, Flexural
- Creep Rate Tensile
- Creep Strain
- Creep Strain Rate
- Creep Strain Rate, True
- Creep Strain, Compressive
- Creep Strain, Tensile
- Creep Strrain, True
- Creep Strength, Tensile
- Creep, Applied Stress
- Creep, Normalized Shear Strain Rate
Optical Properties:
-
- Absorbance
- Birefringence
- Extiction Coefficient
- Normal Spectral Emissivity
- Normal Total Emissivity
- Refractive Index
Mechanical Properties – Other:
-
- Adhesion
- Adhesion Strength
- Biaxial Strain
- Burst Pressure
- Compressibility
- Compressive Plastic Deformation
- Compressive Strain
- Compressive Strain at Fracture
- Crack Growth rate
- Crack Growth Rate (da/dn)
- Crack Length
- Elongation
- Elongation at Break
- Elongation at Yield
- Film Strain
- Flexural Strain at Fracture
- Fracture Energy
- Fracture Toughness, K(lc)
- Impact Energy
- Load
- Loss tangent (tan delete)
- Mechanical Loss Factor
- Normal Strain
- Peel Strain
- Plastic Strain
- Plastic Strain at Fracture
- Poisson’s Ratio
- Reduction of Area
- Relaxation, Stress Remaining
Other Properties:
- Activation Enthalpy
- Coefficient of Friction
- Composition
- Corrosion Mass Loss
- Cure Schedule
- Cure Time
- Diffusion Distance
- Diffusion Energy, Grain Boundary
- Dissolution of Nickel
- EMMI Spiral Flow
- Failure Probability
- Film Thickness
- Film Thickness Retention
- Flow Time
- Gel Time
- Grain Size
- Intermetallic Grain Radius
- Intermetallic Grains Density
- Intermetallic Thickness
- Intermetallic Total Grains Volume
- Lifetime
- Linear Shrinkage
- Linear Swelling
- Mass Diffusion Coefficient
- Moisture Content
- Molding Time
- Oxidation Rate
- Oxide Thickness
- Pore Size