La banca dati MPMD contiene dati ed informazioni sulle proprietà termiche, meccaniche, elettriche e fisiche dei materiali per il packaging dei componenti microelettronici ed è disponibile in formato fruibile via Web. La banca dati è costantemente aggiornata ed ampliata.

Nella banca dati sono presenti 1.080 materiali e 23.400 curve dati con 405 proprietà.

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Principali gruppi di materiali trattati

    • Elements
      Metal Alloys
      Solders – Leaded
      Solders – Lead Free
      Intermetallics, Miscellaneous
      Intermetallics, Aluminides
      Intermetallics, Beryllides
      Intermetallics, Silicides
      Ceramics – Oxides
      Ceramics – High K Oxides
      Ceramics – Nitrides, Silicides, Carbides,…
      Molding Compounds
      Encapsulants and Underfill Materials
      Adhesives
      Coating and Unfilled Epoxies
      Polymers – Polyimides
      Polymers – Others
      Composites – Thermal Management
      Composites – Laminates
    • Semiconductors
      Liquids & Gases

 

Principali proprietà presenti nel MPMD

Thermophysical Properties:

    • Coefficient of Thermal Expansion
      Coefficient of Thermal Expansion (Z)
      Contact Angle
      Cross-Linking Density
      Cure Degree
      Cure Temperature
      Curie Temperature
      Density
      Glass transition Temp (Master Curve)
      Glass Transition Temperature
      Interfacial Tension
      Liquide Temperature
      Mean Coeff. of Thermal Expansion
      Mean Coeff. of Thermal Expansion (Z)
      Molar Heat capacity
      Reflectance
      Relative Density
      Softening Temperature
      Solidus Temperature
      Specific Heat Capacity
      Surface Tension
      Thermal Conductivity
      Thermal Conductivity Film
      Thermal expansion
      Thermal Expansion (Z)
      Thermal Expansion Percent
      Thermal Impedance
      Thermal Resistance
      Thermal Resistance Junction – Heat Sink
      Viscosity

 

Electrical Properties: 

    • Attenuation
      Coefficient of Electrical Resistivity
      Dielectric Constant
      Dielectric Loss Index
      Dissipation Factor
      Electrical Conductivity
      Electrical Resistivity
      Electrical Resistivity, Film
      Electrical Resistivity, ohm m
      Insulation Resistance
      Leekage Conductance
      Permittivity
      Piezoelectric Constant
      Piezoresistance Coefficient
      Relative Electrical Resistance
      Seebeck Coefficient
      Surface Resistivity
      Volume Resistivity

 

Mechanical Properties – Modulus:

    • Bulk ModulusGPa
      Bulk Modulus, MPa
      Compressive Modulus, GPa
      Compressive Modulus, MPA
      Dynamic Shear Modulus
      Dynamic Young’s Modulus
      Elastic Modulus (out-of-Plane)
      Flexural Modulus
      Flexural Modulus, MPa
      Loss Modulus
      Relaxation Modulus
      Relaxation Modulus (master Curve)
      Young’s Modulus, GPa
      Young’s Modulus, MPa

 

Mechanical Properties – Strength:

    • Bend Strength
      Biaxial Flexural Strength, Ultimate
      Compressive Strength, Yield
      Die Shear Strength
      Flexural Strength
      Fracture Strength
      Lap Shear Strength
      Shear Strength
      Shear Strength, Yield
      Tensile Strength, Ultimate
      Tensile Strength, Break
      • Tensile Strength, Yield
      Yield Strength, Flexural

 

Mechanical Properties – Stress:

    • Biaxial Stress
      Biaxial Stress, Yield
      Compressive Lower Yield Stress
      Compressive Stress
      Compressive Stress, True
      Critical Resolved Shear Stress
      Cure Stress
      Elastic Flexural Limit
      Film Stress
      Flexural Stress
      Flow Stress
      Residual Stress
      Shear Stress
      Stress Relaxation
      Tensile Stress
      Tensile Stress, True
      Tensile Upper Yield Stress
      Thermal Stress
      Transverse Rupture Stress

 

Mechanical Properties – Hardness:

    • Brinell hardness
      Knoop Hardness
      Microhardness
      Rockwell A Hardness
      Rockwell hardness
      Shore hardness
      Vickers Hardness
      Vickers Hardness, HV
      Mechanical Properties – Fatigue:
      Fatigue Life
      Fatigue Stress
      Fatigue, Bend Strain Range
      Fatigue, Load Drop
      Fatigue, Maximum Stress
      Fatique Shear Stress Range
      Fatigue Shear Strain Range
      Fatigue, Stress Amplitude
      Fatigue, Stress Amplitude Change
      Plastic Strain Range

 

Mechanical Properties – Creep:

    • Compressive Creep Strain, True
      Creep Compliance
      Creep Life
      Creep Plastic Strain
      Creep Rate, Compressive
      Creep Rate, Flexural
      Creep Rate Tensile
      Creep Strain
      Creep Strain Rate
      Creep Strain Rate, True
      Creep Strain, Compressive
      Creep Strain, Tensile
      Creep Strrain, True
      Creep Strength, Tensile
      Creep, Applied Stress
      Creep, Normalized Shear Strain Rate

 

Optical Properties:

    • Absorbance
      Birefringence
      Extiction Coefficient
      Normal Spectral Emissivity
      Normal Total Emissivity
      Refractive Index

 

Mechanical Properties – Other:

    • Adhesion
      Adhesion Strength
      Biaxial Strain
      Burst Pressure
      Compressibility
      Compressive Plastic Deformation
      Compressive Strain
      Compressive Strain at Fracture
      Crack Growth rate
      Crack Growth Rate (da/dn)
      Crack Length
      Elongation
      Elongation at Break
      Elongation at Yield
      Film Strain
      Flexural Strain at Fracture
      Fracture Energy
      Fracture Toughness, K(lc)
      Impact Energy
      Load
      Loss tangent (tan delete)
      Mechanical Loss Factor
      Normal Strain
      Peel Strain
      Plastic Strain
      Plastic Strain at Fracture
      Poisson’s Ratio
      Reduction of Area
      Relaxation, Stress Remaining

 

Other Properties:

  • Activation Enthalpy
  • Coefficient of Friction
  • Composition
  • Corrosion Mass Loss
  • Cure Schedule
  • Cure Time
  • Diffusion Distance
  • Diffusion Energy, Grain Boundary
  • Dissolution of Nickel
  • EMMI Spiral Flow
  • Failure Probability
  • Film Thickness
  • Film Thickness Retention
  • Flow Time
  • Gel Time
  • Grain Size
  • Intermetallic Grain Radius
  • Intermetallic Grains Density
  • Intermetallic Thickness
  • Intermetallic Total Grains Volume
  • Lifetime
  • Linear Shrinkage
  • Linear Swelling
  • Mass Diffusion Coefficient
  • Moisture Content
  • Molding Time
  • Oxidation Rate
  • Oxide Thickness
  • Pore Size