La banca dati MPMD contiene dati ed informazioni sulle proprietà termiche, meccaniche, elettriche e fisiche dei materiali per il packaging dei componenti microelettronici ed è disponibile in formato fruibile via Web. La banca dati è costantemente aggiornata ed ampliata.

Principali gruppi di materiali trattati

    • Elements
      Metal Alloys
    • Solders – Leaded
      Solders – Lead Free
      Intermetallics, Miscellaneous
      Intermetallics, Aluminides
    • Intermetallics, Beryllides
    • Intermetallics, Silicides
    • Ceramics – Oxides
    • Ceramics – High K Oxides
    • Ceramics – Nitrides, Silicides, Carbides,…
    • Molding Compounds
    • Encapsulants and Underfill Materials
    • Adhesives
    • Coating and Unfilled Epoxies
    • Polymers – Polyimides
    • Polymers – Others
    • Composites – Thermal Management
    • Composites – Laminates
    • Semiconductors
      Liquids & Gases

 

Principali proprietà presenti nel MPMD

Thermophysical Properties:

    • Coefficient of Thermal Expansion
    • Coefficient of Thermal Expansion (Z)
    • Contact Angle
    • Cross-Linking Density
    • Cure Degree
    • Cure Temperature
    • Curie Temperature
    • Density
    • Glass transition Temp (Master Curve)
    • Glass Transition Temperature
    • Interfacial Tension
    • Liquide Temperature
    • Mean Coeff. of Thermal Expansion
    • Mean Coeff. of Thermal Expansion (Z)
    • Molar Heat capacity
    • Reflectance
    • Relative Density
    • Softening Temperature
    • Solidus Temperature
    • Specific Heat Capacity
    • Surface Tension
    • Thermal Conductivity
    • Thermal Conductivity Film
    • Thermal expansion
    • Thermal Expansion (Z)
    • Thermal Expansion Percent
    • Thermal Impedance
    • Thermal Resistance
    • Thermal Resistance Junction – Heat Sink
    • Viscosity

 

Electrical Properties: 

    • Attenuation
    • Coefficient of Electrical Resistivity
    • Dielectric Constant
    • Dielectric Loss Index
    • Dissipation Factor
    • Electrical Conductivity
    • Electrical Resistivity
    • Electrical Resistivity, Film
    • Electrical Resistivity, ohm m
    • Insulation Resistance
    • Leekage Conductance
    • Permittivity
    • Piezoelectric Constant
    • Piezoresistance Coefficient
    • Relative Electrical Resistance
    • Seebeck Coefficient
    • Surface Resistivity
    • Volume Resistivity

 

Mechanical Properties – Modulus:

    • Bulk ModulusGPa
    • Bulk Modulus, MPa
    • Compressive Modulus, GPa
    • Compressive Modulus, MPA
    • Dynamic Shear Modulus
    • Dynamic Young’s Modulus
    • Elastic Modulus (out-of-Plane)
    • Flexural Modulus
    • Flexural Modulus, MPa
    • Loss Modulus
    • Relaxation Modulus
    • Relaxation Modulus (master Curve)
    • Young’s Modulus, GPa
    • Young’s Modulus, MPa

 

Mechanical Properties – Strength:

    • Bend Strength
    • Biaxial Flexural Strength, Ultimate
    • Compressive Strength, Yield
    • Die Shear Strength
    • Flexural Strength
    • Fracture Strength
    • Lap Shear Strength
    • Shear Strength
    • Shear Strength, Yield
    • Tensile Strength, Ultimate
      Tensile Strength, Break
      • Tensile Strength, Yield
      Yield Strength, Flexural

 

Mechanical Properties – Stress:

    • Biaxial Stress
    • Biaxial Stress, Yield
    • Compressive Lower Yield Stress
    • Compressive Stress
    • Compressive Stress, True
    • Critical Resolved Shear Stress
    • Cure Stress
    • Elastic Flexural Limit
    • Film Stress
    • Flexural Stress
    • Flow Stress
    • Residual Stress
    • Shear Stress
    • Stress Relaxation
    • Tensile Stress
    • Tensile Stress, True
    • Tensile Upper Yield Stress
    • Thermal Stress
    • Transverse Rupture Stress

 

Mechanical Properties – Hardness:

    • Brinell hardness
    • Knoop Hardness
    • Microhardness
    • Rockwell A Hardness
    • Rockwell hardness
    • Shore hardness
    • Vickers Hardness
    • Vickers Hardness, HV
    • Mechanical Properties – Fatigue:
    • Fatigue Life
    • Fatigue Stress
    • Fatigue, Bend Strain Range
    • Fatigue, Load Drop
    • Fatigue, Maximum Stress
    • Fatique Shear Stress Range
      Fatigue Shear Strain Range
    • Fatigue, Stress Amplitude
    • Fatigue, Stress Amplitude Change
    • Plastic Strain Range

 

Mechanical Properties – Creep:

    • Compressive Creep Strain, True
    • Creep Compliance
    • Creep Life
    • Creep Plastic Strain
    • Creep Rate, Compressive
    • Creep Rate, Flexural
    • Creep Rate Tensile
    • Creep Strain
    • Creep Strain Rate
    • Creep Strain Rate, True
    • Creep Strain, Compressive
    • Creep Strain, Tensile
    • Creep Strrain, True
    • Creep Strength, Tensile
    • Creep, Applied Stress
    • Creep, Normalized Shear Strain Rate

 

Optical Properties:

    • Absorbance
    • Birefringence
    • Extiction Coefficient
    • Normal Spectral Emissivity
    • Normal Total Emissivity
    • Refractive Index

 

Mechanical Properties – Other:

    • Adhesion
    • Adhesion Strength
    • Biaxial Strain
    • Burst Pressure
    • Compressibility
    • Compressive Plastic Deformation
    • Compressive Strain
    • Compressive Strain at Fracture
    • Crack Growth rate
    • Crack Growth Rate (da/dn)
    • Crack Length
    • Elongation
    • Elongation at Break
    • Elongation at Yield
    • Film Strain
    • Flexural Strain at Fracture
    • Fracture Energy
    • Fracture Toughness, K(lc)
    • Impact Energy
    • Load
    • Loss tangent (tan delete)
    • Mechanical Loss Factor
    • Normal Strain
    • Peel Strain
    • Plastic Strain
    • Plastic Strain at Fracture
    • Poisson’s Ratio
    • Reduction of Area
    • Relaxation, Stress Remaining

 

Other Properties:

  • Activation Enthalpy
  • Coefficient of Friction
  • Composition
  • Corrosion Mass Loss
  • Cure Schedule
  • Cure Time
  • Diffusion Distance
  • Diffusion Energy, Grain Boundary
  • Dissolution of Nickel
  • EMMI Spiral Flow
  • Failure Probability
  • Film Thickness
  • Film Thickness Retention
  • Flow Time
  • Gel Time
  • Grain Size
  • Intermetallic Grain Radius
  • Intermetallic Grains Density
  • Intermetallic Thickness
  • Intermetallic Total Grains Volume
  • Lifetime
  • Linear Shrinkage
  • Linear Swelling
  • Mass Diffusion Coefficient
  • Moisture Content
  • Molding Time
  • Oxidation Rate
  • Oxide Thickness
  • Pore Size

Link

 MPMD Brochure