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MPMD (Microelectronics Packaging Materials Database)
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La banca dati MPMD contiene dati ed informazioni sulle proprietà termiche, meccaniche, elettriche e fisiche dei materiali per il packaging dei componenti microelettronici ed è disponibile in formato fruibile via Web. La banca dati è costantemente aggiornata ed ampliata.
Principali gruppi di materiali trattati
Elements
Metal Alloys
Solders - Leaded
Solders - Lead Free
Intermetallics, Miscellaneous
Intermetallics, Aluminides
Intermetallics, Beryllides
Intermetallics, Silicides
Ceramics - Oxides
Ceramics - High K Oxides
Ceramics - Nitrides, Silicides, Carbides,...
Molding Compounds
Encapsulants and Underfill Materials
Adhesives
Coating and Unfilled Epoxies
Polymers - Polyimides
Polymers - Others
Composites - Thermal Management
Composites - Laminates
Semiconductors
Liquids & Gases
Principali proprietà presenti nel MPMD
Thermophysical Properties:
Coefficient of Thermal Expansion
Coefficient of Thermal Expansion (Z)
Contact Angle
Cross-Linking Density
Cure Degree
Cure Temperature
Curie Temperature
Density
Glass transition Temp (Master Curve)
Glass Transition Temperature
Interfacial Tension
Liquide Temperature
Mean Coeff. of Thermal Expansion
Mean Coeff. of Thermal Expansion (Z)
Molar Heat capacity
Reflectance
Relative Density
Softening Temperature
Solidus Temperature
Specific Heat Capacity
Surface Tension
Thermal Conductivity
Thermal Conductivity Film
Thermal expansion
Thermal Expansion (Z)
Thermal Expansion Percent
Thermal Impedance
Thermal Resistance
Thermal Resistance Junction – Heat Sink
Viscosity
Electrical Properties:
Attenuation
Coefficient of Electrical Resistivity
Dielectric Constant
Dielectric Loss Index
Dissipation Factor
Electrical Conductivity
Electrical Resistivity
Electrical Resistivity, Film
Electrical Resistivity, ohm m
Insulation Resistance
Leekage Conductance
Permittivity
Piezoelectric Constant
Piezoresistance Coefficient
Relative Electrical Resistance
Seebeck Coefficient
Surface Resistivity
Volume Resistivity
Mechanical Properties – Modulus:
Bulk ModulusGPa
Bulk Modulus, MPa
Compressive Modulus, GPa
Compressive Modulus, MPA
Dynamic Shear Modulus
Dynamic Young’s Modulus
Elastic Modulus (out-of-Plane)
Flexural Modulus
Flexural Modulus, MPa
Loss Modulus
Relaxation Modulus
Relaxation Modulus (master Curve)
Young’s Modulus, GPa
Young’s Modulus, MPa
Mechanical Properties – Strength:
Bend Strength
Biaxial Flexural Strength, Ultimate
Compressive Strength, Yield
Die Shear Strength
Flexural Strength
Fracture Strength
Lap Shear Strength
Shear Strength
Shear Strength, Yield
Tensile Strength, Break
Tensile Strength, Ultimate
Tensile Strength, Yield
Yield Strength, Flexural
Mechanical Properties – Stress:
Biaxial Stress
Biaxial Stress, Yield
Compressive Lower Yield Stress
Compressive Stress
Compressive Stress, True
Critical Resolved Shear Stress
Cure Stress
Elastic Flexural Limit
Film Stress
Flexural Stress
Flow Stress
Residual Stress
Shear Stress
Stress Relaxation
Tensile Stress
Tensile Stress, True
Tensile Upper Yield Stress
Thermal Stress
Transverse Rupture Stress
Mechanical Properties – Hardness:
Brinell hardness
Knoop Hardness
Microhardness
Rockwell A Hardness
Rockwell hardness
Shore hardness
Vickers Hardness
Vickers Hardness, HV
Mechanical Properties – Fatigue:
Fatigue Life
Fatigue Stress
Fatigue, Bend Strain Range
Fatigue, Load Drop
Fatigue, Maximum Stress
Fatigue Shear Strain Range
Fatique Shear Stress Range
Fatigue, Stress Amplitude
Fatigue, Stress Amplitude Change
Plastic Strain Range
Mechanical Properties – Creep:
Compressive Creep Strain, True
Creep Compliance
Creep Life
Creep Plastic Strain
Creep Rate, Compressive
Creep Rate, Flexural
Creep Rate Tensile
Creep Strain
Creep Strain Rate
Creep Strain Rate, True
Creep Strain, Compressive
Creep Strain, Tensile
Creep Strrain, True
Creep Strength, Tensile
Creep, Applied Stress
Creep, Normalized Shear Strain Rate
Optical Properties:
Absorbance
Birefringence
Extiction Coefficient
Normal Spectral Emissivity
Normal Total Emissivity
Refractive Index
Mechanical Properties – Other:
Adhesion
Adhesion Strength
Biaxial Strain
Burst Pressure
Compressibility
Compressive Plastic Deformation
Compressive Strain
Compressive Strain at Fracture
Crack Growth rate
Crack Growth Rate (da/dn)
Crack Length
Elongation
Elongation at Break
Elongation at Yield
Film Strain
Flexural Strain at Fracture
Fracture Energy
Fracture Toughness, K(lc)
Impact Energy
Load
Loss tangent (tan delete)
Mechanical Loss Factor
Normal Strain
Peel Strain
Plastic Strain
Plastic Strain at Fracture
Poisson’s Ratio
Reduction of Area
Relaxation, Stress Remaining
Other Properties:
Activation Enthalpy
Coefficient of Friction
Composition
Corrosion Mass Loss
Cure Schedule
Cure Time
Diffusion Distance
Diffusion Energy, Grain Boundary
Dissolution of Nickel
EMMI Spiral Flow
Failure Probability
Film Thickness
Film Thickness Retention
Flow Time
Gel Time
Grain Size
Intermetallic Grain Radius
Intermetallic Grains Density
Intermetallic Thickness
Intermetallic Total Grains Volume
Lifetime
Linear Shrinkage
Linear Swelling
Mass Diffusion Coefficient
Moisture Content
Molding Time
Oxidation Rate
Oxide Thickness
Pore Size
Link
 MPMD - Demo gratuito
MPMD Brochure 
(144,0 Kb)
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