Infodoc: Banca dati CINDAS LLC MPMD Microelectronics Packaging Materials Database

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Banche dati CINDAS LLC ASMD (Aerospace Structural Metals Database) DTDH (Damage Tolerant Design Handbook) HPAD (High Performance Alloys Database) MPMD (Microelectronics Packaging Materials Database) SAH (Structural Alloys Handbook) TPMD (Thermophysical Properties of Matter Database)
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MPMD (Microelectronics Packaging Materials Database)


La banca dati MPMD contiene dati ed informazioni sulle proprietà termiche, meccaniche, elettriche e fisiche dei materiali per il packaging dei componenti microelettronici ed è disponibile in formato fruibile via Web. La banca dati è costantemente aggiornata ed ampliata.

Principali gruppi di materiali trattati
    Elements
    Metal Alloys
    Solders - Leaded
    Solders - Lead Free
    Intermetallics, Miscellaneous
    Intermetallics, Aluminides
    Intermetallics, Beryllides
    Intermetallics, Silicides
    Ceramics - Oxides
    Ceramics - High K Oxides
    Ceramics - Nitrides, Silicides, Carbides,...
    Molding Compounds
    Encapsulants and Underfill Materials
    Adhesives
    Coating and Unfilled Epoxies
    Polymers - Polyimides
    Polymers - Others
    Composites - Thermal Management
    Composites - Laminates
    Semiconductors
    Liquids & Gases
Principali proprietà presenti nel MPMD

Thermophysical Properties:

    Coefficient of Thermal Expansion
    Coefficient of Thermal Expansion (Z)
    Contact Angle
    Cross-Linking Density
    Cure Degree
    Cure Temperature
    Curie Temperature
    Density
    Glass transition Temp (Master Curve)
    Glass Transition Temperature
    Interfacial Tension
    Liquide Temperature
    Mean Coeff. of Thermal Expansion
    Mean Coeff. of Thermal Expansion (Z)
    Molar Heat capacity
    Reflectance
    Relative Density
    Softening Temperature
    Solidus Temperature
    Specific Heat Capacity
    Surface Tension
    Thermal Conductivity
    Thermal Conductivity Film
    Thermal expansion
    Thermal Expansion (Z)
    Thermal Expansion Percent
    Thermal Impedance
    Thermal Resistance
    Thermal Resistance Junction – Heat Sink
    Viscosity
Electrical Properties:

    Attenuation
    Coefficient of Electrical Resistivity
    Dielectric Constant
    Dielectric Loss Index
    Dissipation Factor
    Electrical Conductivity
    Electrical Resistivity
    Electrical Resistivity, Film
    Electrical Resistivity, ohm m
    Insulation Resistance
    Leekage Conductance
    Permittivity
    Piezoelectric Constant
    Piezoresistance Coefficient
    Relative Electrical Resistance
    Seebeck Coefficient
    Surface Resistivity
    Volume Resistivity
Mechanical Properties – Modulus:

    Bulk ModulusGPa
    Bulk Modulus, MPa
    Compressive Modulus, GPa
    Compressive Modulus, MPA
    Dynamic Shear Modulus
    Dynamic Young’s Modulus
    Elastic Modulus (out-of-Plane)
    Flexural Modulus
    Flexural Modulus, MPa
    Loss Modulus
    Relaxation Modulus
    Relaxation Modulus (master Curve)
    Young’s Modulus, GPa
    Young’s Modulus, MPa
Mechanical Properties – Strength:

    Bend Strength
    Biaxial Flexural Strength, Ultimate
    Compressive Strength, Yield
    Die Shear Strength
    Flexural Strength
    Fracture Strength
    Lap Shear Strength
    Shear Strength
    Shear Strength, Yield
    Tensile Strength, Break
    Tensile Strength, Ultimate
    Tensile Strength, Yield
    Yield Strength, Flexural
Mechanical Properties – Stress:

    Biaxial Stress
    Biaxial Stress, Yield
    Compressive Lower Yield Stress
    Compressive Stress
    Compressive Stress, True
    Critical Resolved Shear Stress
    Cure Stress
    Elastic Flexural Limit
    Film Stress
    Flexural Stress
    Flow Stress
    Residual Stress
    Shear Stress
    Stress Relaxation
    Tensile Stress
    Tensile Stress, True
    Tensile Upper Yield Stress
    Thermal Stress
    Transverse Rupture Stress
Mechanical Properties – Hardness:

    Brinell hardness
    Knoop Hardness
    Microhardness
    Rockwell A Hardness
    Rockwell hardness
    Shore hardness
    Vickers Hardness
    Vickers Hardness, HV
    Mechanical Properties – Fatigue:
    Fatigue Life
    Fatigue Stress
    Fatigue, Bend Strain Range
    Fatigue, Load Drop
    Fatigue, Maximum Stress
    Fatigue Shear Strain Range
    Fatique Shear Stress Range
    Fatigue, Stress Amplitude
    Fatigue, Stress Amplitude Change
    Plastic Strain Range
Mechanical Properties – Creep:

    Compressive Creep Strain, True
    Creep Compliance
    Creep Life
    Creep Plastic Strain
    Creep Rate, Compressive
    Creep Rate, Flexural
    Creep Rate Tensile
    Creep Strain
    Creep Strain Rate
    Creep Strain Rate, True
    Creep Strain, Compressive
    Creep Strain, Tensile
    Creep Strrain, True
    Creep Strength, Tensile
    Creep, Applied Stress
    Creep, Normalized Shear Strain Rate
Optical Properties:

    Absorbance
    Birefringence
    Extiction Coefficient
    Normal Spectral Emissivity
    Normal Total Emissivity
    Refractive Index
Mechanical Properties – Other:

    Adhesion
    Adhesion Strength
    Biaxial Strain
    Burst Pressure
    Compressibility
    Compressive Plastic Deformation
    Compressive Strain
    Compressive Strain at Fracture
    Crack Growth rate
    Crack Growth Rate (da/dn)
    Crack Length
    Elongation
    Elongation at Break
    Elongation at Yield
    Film Strain
    Flexural Strain at Fracture
    Fracture Energy
    Fracture Toughness, K(lc)
    Impact Energy
    Load
    Loss tangent (tan delete)
    Mechanical Loss Factor
    Normal Strain
    Peel Strain
    Plastic Strain
    Plastic Strain at Fracture
    Poisson’s Ratio
    Reduction of Area
    Relaxation, Stress Remaining
Other Properties:

    Activation Enthalpy
    Coefficient of Friction
    Composition
    Corrosion Mass Loss
    Cure Schedule
    Cure Time
    Diffusion Distance
    Diffusion Energy, Grain Boundary
    Dissolution of Nickel
    EMMI Spiral Flow
    Failure Probability
    Film Thickness
    Film Thickness Retention
    Flow Time
    Gel Time
    Grain Size
    Intermetallic Grain Radius
    Intermetallic Grains Density
    Intermetallic Thickness
    Intermetallic Total Grains Volume
    Lifetime
    Linear Shrinkage
    Linear Swelling
    Mass Diffusion Coefficient
    Moisture Content
    Molding Time
    Oxidation Rate
    Oxide Thickness
    Pore Size

Link
 MPMD - Demo gratuito
MPMD - Instructional Video

World Scientific



MPMD Brochure (667,8 Kb)